808AB-DH高导热电子灌封胶 导热1.0封装胶水 环氧树脂导热灌封料epoxy

808AB-DH是双剂型环氧树脂导热绝缘密封材料，广泛应用于电子零组件、电子变压器、充电桩、滤清器、负离子发生器、电容、电源模块、LED模组、线路元件、水族水泵、电力电器部件、汽车零部件、机电五金、光电灯饰等的绝缘灌注、粘接、防潮封填等；混合后黏度低、流动性强且具有适当的可操作时间；固化物导热性高、收缩性低、表面光亮、坚硬、附着力及密封性强，耐化学品特性优良，具有优良的电气特性与物性。
固化前参数：
                             主剂808A-DH 
外      观               黑、灰等色液体 
比      重                2.2±0.05 
粘度（25）         15000-35000cps 

                            固化剂808B-DH
外      观               透明微黄液体
比      重               1.05±0.05
粘度（25）          70-150cps

混合比例：     A ：B = 100：10 （重量比）
可使用时间：  
    主剂和固化剂混合后的可使用时间，是依混合总量和操作的温度而定。通常100克的混合胶在25℃时可使用时间为40-60分钟；因此，应根据实际使用情况合理调配胶水以免浪费。
 固化条件：
     1、常温下一般只需要24小时完全固化，3-5小时初步固化或加温80度1小时固化
     2、此外本司工程部还可根据客户需求调整固化时间。
固化物特性
耐电压        Kv/mm       16-18            
耐温          ℃                  80-100
硬度          shore  D       80-85            
绝缘电阻     Ω-cm          2.5×1014
导热率       W／M.°C      0.9-1.1

808ab-dh is a double dosage epoxy resin heat conduction and insulation sealing material, which is widely used in the insulation pouring, bonding and moisture-proof sealing of electronic components, electronic transformers, charging piles, filters, anion generators, capacitors, power modules, LED modules, circuit components, aquarium water pumps, power and electrical components, automobile components, mechanical and electrical hardware, photoelectric lighting, etc.; after mixing, it is sticky Low degree, strong fluidity and proper operation time; high thermal conductivity, low shrinkage, bright and hard surface, strong adhesion and sealing, excellent chemical resistance, excellent electrical and physical properties.

Parameters before curing:

Main agent 808a-dh

Appearance black, gray and other color liquid

Specific gravity 2.2 ± 0.05

Viscosity (25) 15000-35000cps

Curing agent 808b-dh

Transparent yellowish liquid

Specific gravity 1.05 ± 0.05

Viscosity (25) 70-150cps

Mixing ratio: A: B = 100:10 (weight ratio)

Available time:

The usable time of main agent and curing agent after mixing depends on the total amount of mixing and the temperature of operation. Generally, 100g of mixed glue can be used for 40-60min at 25 ℃; therefore, the glue should be mixed reasonably according to the actual use to avoid waste.

Curing conditions:

1. Generally, it only needs 24 hours to cure completely at room temperature, 3-5 hours to cure initially or 80 ℃ to cure for 1 hour

2. In addition, the Engineering Department of our company can also adjust the curing time according to the needs of customers.

Curing properties

Withstand voltage kV / mm 16-18

Temperature resistance 80-100

Hardness Shore D 80-85

Insulation resistance Ω - cm 2.5 × 1014

Thermal conductivity w / m. ° C 0.9-1.1