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808AB-K, Fast curing epoxy potting adhesive, fast drying electronic potting adhesive
808AB-K series dual dosage form fast curing epoxy resin insulation sealing material is widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion genera...
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808AB-GT, High temperature resistant epoxy resin sealing adhesive, high temperature resistant electr
808AB-GT series dual dosage form high-temperature resistant epoxy resin insulation sealing material is widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, neg...
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808AB-DH, Thermal conductive epoxy sealant, thermal conductive electronic sealant, thermal conductiv
808AB-DH is a dual dose epoxy resin thermal insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitor...
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909AB-K-5, Epoxy resin structural adhesive, epoxy AB adhesive, 5-minute curing AB adhesive, DP100
909AB-K-5 is a dual liquid fast curing epoxy resin structural adhesive used for rapid curing at room temperature or low temperature. After curing, the bonding layer has high hardness and can withstand strong impacts and vibrations. The bonding layer has good m...
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808AB， Epoxy resin potting adhesive, electronic potting adhesive, potting AB adhesive
808AB is a dual dose epoxy resin insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitors, power mo...
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H907-HF-R， Elastic single component epoxy adhesive, soft epoxy adhesive, flexible single component e
H907-HF-R is a single component modified epoxy resin high elasticity adhesive widely used for bonding and fixing various electronic components, electrical appliances, electromechanical hardware, magnetic components, optoelectronic products, automotive parts co...
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H907-K low-temperature fast-curing one-component epoxy resin adhesive, 80-degree curing epoxy resin
H907-K series non solvent single component low-temperature fast curing epoxy resin products have low coefficient of linear expansion, high temperature resistance, impact resistance, vibration resistance, and high hardness. Widely used for bonding and fixing el...
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H907-HF-Z magnetic core center column adhesive, single-component elastic epoxy resin adhesive, trans
The non-solvent and low halogen H907-HF-Z is a general one-component flexibility epoxy adhesive, which widely used in electronic and electric fields. It's been widely applied in the bonding and fixation of various electronic components, electrical applianc...
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808AB-CM环氧树脂包封胶 NTC温度传感器包封料密封胶 热敏电阻电感封装胶水
环氧树脂包封/密封胶808AB-CM 一、 概说：808AB-CM环氧包封密封材料具有粘度适中、外观成型性好、操作使用期长等特点。适用于聚酯膜电容以及其它薄膜电容、NTC温度传感器、电感、线路板、磁环线圈、电阻器、热敏电阻、各类电路板及其它电子元器件等的外包封、密封保护等；混合后黏度低、抗流挂特性强且具有较长的可操作时间，易于生产作业。固化物收缩性低、表面光亮、坚韧、附着力及密封性强，耐化学品特性优良，具有优良的电气特性与物性。二、 固化前参数： &nbs...
