H900-5邦定热胶冷封热胶 IC保密胶水 COB帮定胶水黑胶 芯片封装包封胶

H900-5系单组份环氧树脂产品（COB邦定热胶冷封）,其固化物表面呈哑光型、粘度强度优秀以及耐温之特性。广泛适用于IC、继电器等电子元器件之遮封。
颜色                  黑色                
比重（25℃）   1.3-1.4                 
粘度（25℃）    30，000-45,000cps  

固化条件：115℃-120℃ 2小时固化
固化物特性:
硬度           Shore  D             85-95         
体积电阻     Ω-cm                 6.1×1014
热线膨胀系数   cm/cm/℃     65×10-5/℃   
表面电阻     Ω-cm                  5.8×1014  
抗弯强度       kg／mm2         8.1          
绝缘破坏电压 kv/mm            16
抗拉强度       kg/mm2           5.2   

H900-5 is a one component epoxy resin product (COB bonding hot glue cold sealing). Its cured surface is matte, excellent viscosity strength and temperature resistance. Widely used in IC, relay and other electronic components.

Color black

Specific gravity (25 ℃) 1.3-1.4

Viscosity (25 ℃) 30000-45000cps

Curing conditions: 115 ℃ - 120 ℃ for 2 hours

Curing properties:

Hardness Shore D 85-95

Volume resistance Ω - cm 6.1 × 1014

Hot wire expansion coefficient cm / cm / ℃ 65 × 10-5 / ℃

Surface resistance Ω - cm 5.8 × 1014

Bending strength kg / mm2 8.1

Insulation failure voltage kV / mm 16

Tensile strength kg / mm2 5.2