H905邦定冷胶 环氧树脂邦定胶黑胶 华创epoxy芯片IC包封胶 电子元件密封胶水

H905(COB邦定冷胶)系非溶剂型单组份含环氧树脂产品，其固化物表面呈亮光型、粘度强度优秀以及耐温之特性。广泛适用于IC等电子元器件之遮封。（调胶水推荐加量为7%-15%）
颜色             黑色/白色               
储存条件:25℃ /2个月
比重 （25℃）    1.4-1.5
粘度 （25℃）    5000-6000 cps
固化条件：110℃/2小时或120℃/1.5小时  
固化物特性:
硬度                Shore    D     85      
体积电阻         Ω-cm         4.7×1014 
表面电阻         Ω-cm         5.8×1014
抗弯强度         kg/mm2       7.1     
绝缘破坏电压  kv/mm         16
 抗拉强度         kg/mm2       5.1                     
 耐锡焊温度       400℃-420℃（3秒钟） 

H905 (COB bond cold adhesive) is a non solvent one component epoxy resin product. The surface of the cured product is bright, with excellent viscosity, strength and temperature resistance. It is widely used in IC and other electronic components. (recommended dosage of mixing glue is 7% - 15%)

Color black / white

Storage condition: 25 ℃ / 2 months

Specific gravity (25 ℃) 1.4-1.5

Viscosity (25 ℃) 5000-6000 CPS

Curing conditions: 110 ℃ / 2 hours or 120 ℃ / 1.5 hours

Curing properties:

Hardness Shore D 85

Volume resistance Ω - cm 4.7 × 1014

Surface resistance Ω - cm 5.8 × 1014

Bending strength kg / mm2 7.1

Insulation failure voltage kV / mm 16

Tensile strength kg / mm2 5.1

Soldering resistance temperature 400 ℃ - 420 ℃ (3 seconds)