H900邦定热胶 COB黑胶密封胶 环氧树脂哑光 芯片IC密封保护胶水高强度

H900单组份环氧树脂产品,其固化物表面呈哑光型、粘度强度优秀以及耐温之特性。广泛适用于IC、继电器等电子元器件之遮封（COB邦定）、电子元器件粘接密封保护绝缘等。
颜色                  黑色                
比重（25℃）   1.4-1.5               
粘度（25℃）     8000-12000cps       
固化条件：115℃-120℃ 1小时固化
固化物特性:
硬度                Shore  D     85-95         
体积电阻          Ω-cm         6.1×1014
热线膨胀系数                     5.6×10-5/℃               
表面电阻          Ω-cm         5.8×1014  
抗弯强度           kg／mm2    10.1          
绝缘破坏电压    kv/mm         16
抗拉强度           kg/mm2       5.2    

H900 single component epoxy resin products, its cured surface is matte type, excellent viscosity strength and temperature resistance. Widely used in IC, relay and other electronic components of the shielding (COB bonding), electronic components bonding seal protection insulation.

Color black

Specific gravity (25 ℃) 1.4-1.5

Viscosity (25 ℃) 8000-12000cps

Curing conditions: 115 ℃ - 120 ℃ for 1 hour

Curing properties:

Hardness Shore D 85-95

Volume resistance Ω - cm 6.1 × 1014

Hot wire expansion coefficient 5.6 × 10-5 / ℃

Surface resistance Ω -cm 5.8 × 1014

Bending strength kg / mm2 10.1

Insulation failure voltage kV / mm 16

Tensile strength kg / mm2 5.2