环氧树脂胶粘剂在电子工业行业的应用epoxy adhesives

    环氧树脂胶粘剂在电子工业上的应用多种多样，从微电路定位直到大电机线圈的粘接。胶粘剂一旦失灵，后果十分严重。电气用胶粘剂除要求机械紧固外，还有导电、绝缘、减振、密封和保护基材等要求。其不同应用所要求的特性包括：使用寿命从数秒至几年不等，工作温度从-270-500°C，用量从不足微克到超过1吨。

环氧树脂胶在电子工业中的应用最为广泛，因为它通用性强、粘接性优、耐温性好、适应性宽、使用方便、电性能好、又耐老化。

在各类电子元器件、电工电器、机电五金、磁性元件、光电产品、汽配组件等领域应有大范围的应用

主要是一些微电子元组件的粘接固定，密封保护，线路板元件的粘接，防水防潮，三防密封；电器组件的绝缘固定；机电器件的绝缘粘接；光电组件的三防保护等等

还有印制电路板无论是则性还是挠性的，都离不开胶粘剂。对于环氧-玻璃板来说，可用缩醛-酚醛、丁腈-酚醛或改性环氧，最高使用温度约1500C。当在260。c高温下使用时，应采用玻璃-有机硅层压板或铜／聚四氟乙烯复合板。刚性印制线路板的叠层装配，可用涂有热塑性或热固性胶粘剂的塑料薄膜粘接在一起。有时复杂的装配件要求薄的、挠性印制电路，此时使用RTV硅橡胶涂层，不仅可作绝缘涂敷层，而且还能减振，由为这种振动会在焊接接头上增加不希望的疲劳负荷。另外，在受力的元件上涂敷环氧胶和有机硅胶，以减少冲击和振动的影响。

电子元件用胶粘剂70%为环氧胶，30%为硅酮胶。

The application of epoxy resin adhesive in electronic industry is various, from microcircuit positioning to large motor coil bonding. Once the adhesive fails, the consequence is very serious. In addition to mechanical fastening, electrical adhesives also have requirements for conducting, insulating, damping, sealing and protecting base materials. The characteristics required for different applications include: service life ranging from a few seconds to several years, operating temperature ranging from - 270-500 ° C, and consumption ranging from less than micrograms to more than 1 ton.

Epoxy resin adhesive is widely used in the electronic industry because of its strong versatility, excellent adhesion, good temperature resistance, wide adaptability, convenient use, good electrical performance and aging resistance.

It should be widely used in various electronic components, electrical appliances, mechanical and electrical hardware, magnetic components, photoelectric products, auto parts and other fields

It mainly includes the bonding and fixation of some microelectronic components, sealing protection, bonding of circuit board components, waterproof and moisture-proof, three proof sealing, insulation fixation of electrical components, insulation bonding of electromechanical components, three proof protection of photoelectric components, etc