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808AB-DE-H3 高导热环氧树脂灌封胶 4.5W导热环氧灌封胶 耐高温灌封胶
808AB-DE-H3 高导热环氧树脂绝缘密封材料广东华创电子材料有限公司推出的808AB-DE-H3，为双组份高导热环氧树脂绝缘密封粘接产品。本品适配电子零组件、散热器、数据中心、机器人元器件、新能源行业、电路板、电机、温度传感器、线材、端子、连接器、电子变压器、充电桩、滤清器、负离子发生器、电容、电源模块、LED模组、线路元件、水族水泵、电力电器部件、汽车零部件、机电五金、光电灯饰等品类，可满足绝缘灌注、粘接、防潮封填等使用需求。产品混合后粘度适中，与金属、塑料基材均可稳定结合，操作时长充足，便于工业化生产使用...
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808AB-DE-G5 耐高温导热环氧树脂绝缘密封材料 3.0导热灌封胶 耐温180度
808AB-DE-G5 耐高温导热环氧树脂绝缘密封材料广东华创电子材料有限公司推出的808AB-DE-G5，是一款耐高温导热型环氧树脂绝缘密封产品。本品可用于电子零组件、电机、温度传感器、线材、端子、连接器、电子变压器、充电桩、滤清器、负离子发生器、电容、电源模块、LED模组、线路元件、水族水泵、电力电器部件、汽车零部件、机电五金、光电灯饰等场景，满足绝缘灌注、粘接、防潮封填等使用需求。产品混合后粘度低、流动性佳、脱泡效果良好，对金属、塑料基材均可形成稳定附着，适用操作时长充足，适配规模化生产作业。胶体固化后收缩率...
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808AB-DE-3 导热环氧树脂灌封胶 电机 散热器粘接3.0导热灌封胶水
808AB-DE-3 高导热环氧树脂灌封胶广东华创电子材料有限公司的 808AB-DE-3为双组份高导热环氧树脂绝缘密封粘接材料，适用于电子零组件、电机、温度传感器、线材、端子、连接器、电子变压器、充电桩、滤清器、负离子发生器、电容、电源模块、LED模组、线路元件、水族水泵、电力电器部件、汽车零部件、机电五金、光电灯饰等产品，可完成绝缘灌注、粘接、防潮封填等工艺。产品混合后粘度适中，对金属、塑料基材具备良好附着力，操作时长充足，便于工业化生产作业。胶体固化后收缩率低，表层质地坚韧，密封与粘接性能稳定，耐化学介质表现...
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808AB-3X低粘度高强度环氧树脂灌封胶 连接器线材灌封防水密封胶
808AB-3X是较长操作时间环氧树脂绝缘密封材料，广泛应用于电子零组件、温度传感器、线材、端子、连接器、电子变压器、充电桩、滤清器、负离子发生器、电容、电源模块、LED模组、线路元件、水族水泵、电力电器部件、汽车零部件、机电五金、光电灯饰等的绝缘灌注、粘接、防潮封填等。混合后黏度低、流动性强且具有适当的可操作时间，易于生产作业。固化物收缩性低、表面光亮、坚韧、附着力及密封性强，耐化学品特性优良，具有优良的电气特性与物性。环氧树脂灌封胶 808A-3X / 808B-3X 技术参数本款为双组份环氧树脂灌封胶，电气绝...
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808AB-K, Fast curing epoxy potting adhesive, fast drying electronic potting adhesive
808AB-K series dual dosage form fast curing epoxy resin insulation sealing material is widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion genera...
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808AB-GT, High temperature resistant epoxy resin sealing adhesive, high temperature resistant electr
808AB-GT series dual dosage form high-temperature resistant epoxy resin insulation sealing material is widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, neg...
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808AB-DH, Thermal conductive epoxy sealant, thermal conductive electronic sealant, thermal conductiv
808AB-DH is a dual dose epoxy resin thermal insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitor...
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909AB-K-5, Epoxy resin structural adhesive, epoxy AB adhesive, 5-minute curing AB adhesive, DP100
909AB-K-5 is a dual liquid fast curing epoxy resin structural adhesive used for rapid curing at room temperature or low temperature. After curing, the bonding layer has high hardness and can withstand strong impacts and vibrations. The bonding layer has good m...
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808AB， Epoxy resin potting adhesive, electronic potting adhesive, potting AB adhesive
808AB is a dual dose epoxy resin insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitors, power mo...
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H907-HF-R， Elastic single component epoxy adhesive, soft epoxy adhesive, flexible single component e
H907-HF-R is a single component modified epoxy resin high elasticity adhesive widely used for bonding and fixing various electronic components, electrical appliances, electromechanical hardware, magnetic components, optoelectronic products, automotive parts co...
